RED OX® - Cleaning of Wafers and Devices
with diamond- coated silicon electrodes
Contamination on wafers, especially metallic particles, can cause major damage. They can disrupt processes during the subsequent treatment steps. The particles often adhere to the wafer by electrostatic adsorption and can hardly be removed. The smaller the particles are, the more difficult they are to remove. Our diamond electrodes remove even the smallest particles.
RED OX® cell is equipped with high performance DIACHEM® electrodes. It is suitable for use in cleaning systems in the semiconductor industry. We also design scalable cells containing our diamond electrodes. Thus, solutions for every system are possible.
Cleaning Process
- Batch single wafer
- Transport devices
Reduction of chemical waste
Wide pH and ORP window
Replacement of external chemicals
The RED OX® cell is a split electrochemical cell equipped with
boron-doped diamond electrodes. The unique structure of the electrodes in combination with the outstanding DIACHEM® coating enables the generation of highly functional rinsing and cleaning media.
Properties of the RED OX® cell
| dimensions (l x w x h) | 420 mm x 210 mm x 98 mm (incl. connections) |
|---|---|
| weight | 12.8 kg |
| max. amperage | 20 A |
| max. voltage | 48 V |
| temperature limits of medium | 14°C up to 70°C |
| maximum pressure difference of anolyte / catholyte | 0.5 bar |
Brief description:
- Divided cell with structured Si-plate electrodes
- Anolyte circuit, groove depth 0.8 mm
- Catholyte circuit, groove depth 1.6 mm
Areas of application:
Chemical syntheses, production of cathodic water
CONDIAS GmbH
Fraunhofer Strasse 1b
D-25524 Itzehoe
